On May 28, NVIDIA CEO Jensen Huang gave an interview to the media, sharing his views on hot topics, including competition in the AI industry and cloud service providers' development of their own chips. When asked about Huawei's recently announced Tau (τ) Scaling Law and "LogicFolding" technology, Huang said that while this represents a major technological breakthrough for Huawei, it does not pose a threat to TSMC.
Huang explained that by using chip stacking and 3D packaging technology, Huawei is able to double or even increase the number of transistors by three to four times without shrinking semiconductor process line widths. He acknowledged this as an excellent technical approach, but noted that TSMC has been developing and applying related technologies for nearly a decade, with a deep and highly advanced technical foundation.
It is reported that He Tingbo, President of Huawei's semiconductor business unit, formally introduced the Law at the 2026 IEEE International Symposium on Circuits and Systems (ISCAS) held on May 25. This marks the first time a Chinese company has proposed a new principle to lead industry development in the global semiconductor field, sparking extensive discussion within the industry.
Related News:
Deepline | He Tingbo and Tau Scaling Law: Huawei flips chip design on its head
Comment